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This is the free Material Data Center Datasheet of Ultrason® E 2010 NAT - PESU - BASF

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Product Texts
Unreinforced, medium viscosity standard injection moulding grade.
Abbreviated designation according to ISO 1043-1: PESU
Processing/Physical Characteristicsdry / condUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 70 / * cm³/10min ISO 1133
Temperature 360 / * °C -
Load 10 / * kg -
Molding shrinkage, parallel 0.8 / * % ISO 294-4, 2577
Molding shrinkage, normal 0.9 / * % ISO 294-4, 2577
ASTM Data
Mold Shrinkage, MD 0.007 mm/mm ASTM D 955
Mechanical propertiesdry / condUnitTest Standard
ISO Data
Tensile Modulus - / 2650 MPa ISO 527
Yield stress - / 85 MPa ISO 527
Yield strain - / 6.9 % ISO 527
Tensile creep modulus, 1h * / 2800 MPa ISO 899-1
Charpy impact strength, +23°C - / N kJ/m² ISO 179/1eU
Charpy impact strength, -30°C - / N kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C - / 7 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C * / 7.5 kJ/m² ISO 179/1eA
ASTM Data
Tensile Strength at Yield 90.3 / - MPa ASTM D 638
Elongation at Yield 6.7 / - % ASTM D 638
Elongation at Break 40 / - % ASTM D 638
Flexural Modulus 2599 / - MPa ASTM D 790
Izod Impact notched, 1/8 in 10 / - J/m ASTM D 256
Thermal propertiesdry / condUnitTest Standard
ISO Data
Glass transition temperature, 10°C/min 225 / * °C ISO 11357-1/-2
Temp. of deflection under load, 1.80 MPa 205 / * °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 218 / * °C ISO 75-1/-2
Vicat softening temperature, B 215 / * °C ISO 306
Coeff. of linear therm. expansion, parallel 52 / * E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. V-0 / * class IEC 60695-11-10
Thickness tested 1.6 / * mm -
Yellow Card available yes / * - -
Burning Behav. at thickness h V-0 / * class IEC 60695-11-10
Thickness tested 3.0 / * mm -
Yellow Card available yes / * - -
Burning Behav. 5V at thickness h 5VA / * class IEC 60695-11-20
Thickness tested 3.0 / * mm -
Yellow Card available yes / * - -
Oxygen index 38 / * % ISO 4589-1/-2
ASTM Data
Coefficient of Thermal Expansion, TD 59.9 E-6/K ASTM D 696
DTUL @ 66 psi 208 °C ASTM D 648
DTUL @ 264 psi 195 °C ASTM D 648
Electrical propertiesdry / condUnitTest Standard
ISO Data
Relative permittivity, 100Hz * / 3.9 - IEC 62631-2-1
Relative permittivity, 1MHz * / 3.8 - IEC 62631-2-1
Dissipation factor, 100Hz * / 17 E-4 IEC 62631-2-1
Dissipation factor, 1MHz * / 140 E-4 IEC 62631-2-1
Volume resistivity * / >1E13 Ohm*m IEC 62631-3-1
Surface resistivity * / >1E15 Ohm IEC 62631-3-2
Electric strength * / 37 kV/mm IEC 60243-1
Comparative tracking index * / 125 - IEC 60112
Other propertiesdry / condUnitTest Standard
Water absorption 2.2 / * % Sim. to ISO 62
Humidity absorption 0.8 / * % Sim. to ISO 62
Density 1370 / - kg/m³ ISO 1183
Density 1370 kg/m³ ASTM D 792
Material specific propertiesdry / condUnitTest Standard
ISO Data
Viscosity number 56 / * cm³/g ISO 307, 1157, 1628
Processing Recommendation Injection MoldingValueUnitTest Standard
Pre-drying - Temperature 140 °C -
Pre-drying - Time 4 h -
Processing humidity ≤0.02 % -
Melt temperature 340 - 390 °C -
Mold temperature 140 - 180 °C -
Diagrams
Viscosity-shear rate , Ultrason® E 2010 NAT, PESU, BASF
Shearstress-shear rate , Ultrason® E 2010 NAT, PESU, BASF
Dynamic Shear modulus-temperature , Ultrason® E 2010 NAT (dry), PESU, BASF
Stress-strain , Ultrason® E 2010 NAT (cond.), PESU, BASF
Secant modulus-strain , Ultrason® E 2010 NAT (cond.), PESU, BASF
Specific volume-temperature (pvT) , Ultrason® E 2010 NAT, PESU, BASF
Tensile modulus-temperature , Ultrason® E 2010 NAT (cond.), PESU, BASF
Fatigue strength , Ultrason® E 2010 NAT, PESU, BASF
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion, Sheet Extrusion, Blow Molding, Thermoforming
Delivery form
Pellets, Natural Color
Regional Availability
Other text information
Injection molding
PREPROCESSING
Pre/Post-processing, max. allowed water content: .02 %
Pre/Post-processing, Pre-drying, Temperature: 140 °C
Pre/Post-processing, Pre-drying, Time: 4 h

PROCESSING
injection molding, Melt temperature, range: 340 - 390 °C
injection molding, Melt temperature, recommended: 360 °C
injection molding, Mold temperature, range: 140 - 180 °C
injection molding, Mold temperature, recommended: 160 °C
injection molding, Dwell time, thermoplastics: 10 min

Pretreatment
Drying temperature: 130 - 150°C
Drying time: minimum 4h
recommended dryer: vaccum or dry air dryer
maximum moisture: 0,02 - 0,05%

Ultrason® can be injection molded by any type of machinery on the market, provided that the plasticizing unit and the mold temperature control system have been configured appropriately. The machinery manufacturer must be consulted if any doubts exist on the ability of various parts to withstand the high temperatures required (e.g. barrel, barrel head, bolted connections, etc.)

Long residence time in combination with high temperatures should be avoided e.g. by pump out material at regular intervals.
During extended interruptions, the barrel temperature should be lowered to about 250-280°C.

It has been found out that heating to the requested processing temperature and shutting down or lowering the temperature is best carried out in two steps.
First, the barrel temperatures are set at the lower processing temperature range for the particular thermoplastic (340 - 350 °C). As soon as these temperatures have reached a steady state, the material in the barrel is pumped out. Second, the barrel temperature can be set to the required processing temperature or the heaters can be shut down.
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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